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5μm Focus Spot PCBA Plated Through Hole Xray Inspection Machine AX8300 Unicomp PTH Void Defect Detector

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5μm Focus Spot PCBA Plated Through Hole Xray Inspection Machine AX8300 Unicomp PTH Void Defect Detector

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Model Number : AX8300

Power Supply : 220V,50Hz/60Hz 4A

Certification : CE, FDA

Weight : 1350kg

MOQ : 1Set

Price : can negotiate

Delivery Time : 15 days

Warranty : 1 year

Brand Name : UNICOMP

Supply Ability : 30 sets per month

Place of Origin : China

Packaging Details : Wooden Case, Waterproof, Anti-collision

Payment Terms : T/T,L/C

Voltage : 110kv

Product name : AX8300

Dimension : 1215*1325*1700(mm)

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5μm Focus Spot PCBA Plated Through Hole X-ray Inspection Machine AX8300
The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of 90kV equipment and excessive energy waste of 130kV models.
Integrated with a high-end flat-panel detector (FPD), the AX8300 captures ultra-high-definition, high-magnification images with industry-leading fineness. Supported by a full 360° rotating worktable, the system enables flexible multi-angle observation and comprehensive detection of hidden defects such as BGA voids, solder cracks, welding shortages and internal packaging flaws.
Key Features
  • 110kV Microfocus X-ray source
  • High resolution Flat Panel Detector (FPD)
  • X/Y/Z/Tilt Motions (table, tube, FPD)
  • 360° Table Rotation
  • Angle View up to 70 Degrees
  • Point and Click Location Navigation
  • CNC Programming for Multiple Image Inspection Routines
  • Maximum Inspection Area: 360 x 340mm
Applications
  • BGA/CSP/FLIPS CHIP: Bridging, Voids, Opens, Excessive/Insufficient solder
  • QFN: Bridging, Voids, Opens, Registration
  • SMT Standard Components: QFP, SOT, SOIC, Chips, Connectors, Others
  • Semiconductor: Bond wire, Die attach VOID, MOLD, VOID
  • Multi-layer Board (MLB): Inner layer registration, PAD stack, Blind/buried vias
Technical Specifications
Model AX8300
Max kV/Type 110 kV/Sealed
Power Consumption 900W
Max. Electron Beam Power 25W
Focal Spot Size 5μm
Geometric Magnification 48.8X
Imaging System (Option) Flat Panel Detector
Door Open Hand-operated door
Monitor 27" HD 4K Display
Dimensions 115x1325x1700mm
Weight 1350kg
Radiation Safety <1μSv/hr
Control Keyboard/Mouse/Joystick
Automated Inspection Standard
Primary Applications Chip inspection/Electronic components/Auto parts, etc.
Note: Focal spot size is variable. Please consult Unicomp for specific requirements.
X-ray Safety Commitment: All x-ray machines manufactured by Unicomp Technology meet the FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems. The FDA-CDRH standard for cabinet x-ray systems states that radiation emissions will not exceed 0.5 millirem/hr at 2" from any external surface. Our machines typically emit 15 times less radiation.
Inspection Images
5μm Focus Spot PCBA Plated Through Hole Xray Inspection Machine AX8300 Unicomp PTH Void Defect Detector

Product Tags:

5μm Focus Spot PCBA Xray Machine

      

Plated Through Hole Inspection Detector

      

AX8300 PTH Void Defect Machine

      
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5μm Focus Spot PCBA Plated Through Hole Xray Inspection Machine AX8300 Unicomp PTH Void Defect Detector Images

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